[Remote] Staff High-Power Laser Assembly Development Engineer

Note: The job is a remote job and is open to candidates in USA. Nokia is a global leader in connectivity for the AI era. They are seeking a highly experienced Staff High-Power Laser Assembly Development Engineer to lead the development, optimization, and industrialization of advanced assembly processes for high-power semiconductor laser products. Responsibilities • Lead the development of assembly designs and manufacturing processes for high-power InP and GaAs laser products • Drive process innovation and optimization to achieve performance, reliability, cost, and manufacturability targets • Analyze and optimize interactions between assembly materials, die attach processes, mechanical stress, thermal performance, and laser operating characteristics • Develop, evaluate, and implement assembly tooling, automation solutions, and characterization methodologies • Perform and interpret die attach stress simulations and correlate results with product performance and reliability data • Lead failure analysis investigations and implement corrective actions to improve product robustness and yield • Support product qualification activities and establish manufacturing quality standards, process controls, and validation methods • Drive the transition of new products from development into volume manufacturing • Collaborate with cross-functional engineering teams to address technical challenges and accelerate product development • Mentor engineers and contribute to the growth of assembly and packaging expertise within the organization Skills • Advanced degree (MS or PhD preferred) in Mechanical Engineering, Materials Engineering, Physics, Photonics, or a related discipline • 10+ years of industry experience in semiconductor laser packaging, assembly development, or a closely related field • Proven expertise in assembly design and process development for high-power InP and/or GaAs laser products • Deep understanding of material interactions, die attach processes, mechanical stress mechanisms, thermal management, stability, and their impact on laser performance • Hands-on experience with assembly tooling, automation systems, characterization techniques, manufacturing process development, and failure analysis methodologies • Experience performing or interpreting die attach stress simulations and related modeling activities • Demonstrated track record of successful product development leading to qualification, volume production, manufacturing scale-up, and automation • Strong knowledge of manufacturing quality systems, process controls, and reliability standards • Experience supporting high-volume optical component manufacturing environments • Knowledge of semiconductor packaging reliability testing and qualification methodologies • Familiarity with statistical analysis and process improvement methodologies • Experience working in multidisciplinary photonics or optical networking organizations Benefits • Corporate Retirement Savings Plan • Health and dental benefits • Short-term disability, and long-term disability • Life insurance, and AD&D – Company paid 2x base pay • Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child) • Paid time off for holidays and Vacation • Employee Stock Purchase Plan • Tuition Assistance Plan • Adoption assistance • Employee Assistance Program/Work Life Resource Program Company Overview • Nokia manufactures mobile devices, network infrastructure, and location-based technology for businesses. It is a sub-organization of Enscryb. It was founded in 1865, and is headquartered in Espoo, Southern Finland, FIN, with a workforce of 10001+ employees. Its website is http://www.nokia.com. Company H1B Sponsorship • Nokia has a track record of offering H1B sponsorships, with 105 in 2026, 262 in 2025, 264 in 2024, 259 in 2023, 250 in 2022, 296 in 2021, 287 in 2020. Please note that this does not guarantee sponsorship for this specific role.